Hi!
Thanks for the swift response. Excellent support, just as we've all gotten used to by now.
Regarding the backwards compatibility I don't think this would change anything for the worse;
the SIP socket headers use the same 0,1" (2.54mm) spacing between the center of the holes,
it's just an almost insignificant change in the hole diameter that would be needed.
I'm not sure how to "make this work in the reference design" so I'll just supply some detailed measurements and hope I can convince you with those numbers and some solid reasoning instead.
It's a little embarrassing but I should have done some actual measurements back at home rather than referring to measurements from a datasheet that proved to be for some other sort of (solid moulded DIP) socket.. or maybe they where listing radii but mistakenly put a diameter symbol there.. never mind...
I just assumed it would be near enough but the measurements I mentioned were WAY off so I hope I didn't lure anyone into getting their caliper out to verify those clearly incorrect pin width measurements.
I did some more accurate measurements when I got back home yesterday.
DigiSpark power and I/O vias:I had some problems measuring the exact inner diameter of the plated vias for the power and I/O pins and I don't think the Eagle file are public(?).
I tried to measure by eye and caliper (holding it over the opening) and by measuring wall-to-wall between the I/0 holes on a proto-shield but these measurement could be more precise.. for example if I found a suitable needle that fits snuggly in those holes.
I'm getting a measurement of approximately 1.3 mm inner diameter with the plating applied.
Is that fairly accurate?
Do be able to get a tight but usable fit with SIP sockets that would have to be increased to.. 1.4 ~ 1.45mm?
DigiSpark headers:0.6 x 0.6 mm square pins, which equates to a "diameter"(/diagonal) of 0.848 mm.
That's a lot of air already between the pins and the inner diameter of the vias..
If you push one of the corners of the pins to one of the via walls when aligning/soldering them there's approximately 0.45 mm of "air"/solder on the opposite side of the pin. Quite a loose fit.
The plastic body of the female header (same for stackable headers) has the standard 2.45 mm by (2.45 * pin count) PCB foot print and a height of 8 mm.
SIP snap-off sockets:As mentioned above, the spacing/pitch is still 2.54 mm (0.1").
The plastic part of the SIP sockets has an approximate PCB footprint 2.45 mm by (2.45 mm * pin count) and a height of 3.0 mm.
The thicker part of the SIP socket pin is approximately 1.36 mm diameter and extends ~1.25 mm below.
That's the part I want to fit inside the vias for a tight and well-aligned fit (precision machined cylinder inside a slightly larger precision machined cylindrical hole).
The rest of the pin below that section should mate reasonably well even if the cone-shaped parts aren't pressed tightly against each other.
My sockets seem to "lock on" with just 1 - 1.5 mm of the thin pin inserted into the socket.
When stacked as tightly as possible the "stacked height" is approximately 4.25mm (plastic body + "through-hole" part of the pin).
The corresponding measurement for the standard headers is ~11mm for a female + male pin (8mm plastic body + 2 mm plastic spacer on male pin + ~1 mm PCB) or 17 mm for stackable female headers
DigiSpark component height:All 3 of my DigiSparks have a maximum component height of of approximately 2.54 mm (PCB surface to the top of the voltage regulator).
With SIP sockets that would still leave 0.46 mm of air between the top of the voltage regulator and the bottom of the first shield.
With a standard female headers there would be 5.46 mm of air between the top of the regulator and the first shield.
You could fit 3 voltage regulators on top of each other in within those 8 mm, though with very limited air cooling. :-)
I did have the 8bit port expander shield soldered up with DIP socket and all but I forgot to measure the height of a DIP IC + DIP socket. :-S
I'm guessing you would need an extra layer of SIP sockets to clear that height.. :-S
Possible side effects:Increasing the via hole from ~1.3 mm to 1.4 mm would give the standard headers an additional 0.05 mm of slack in either direction from the center of the 2.54 mm spaced holes.
I think that's negligable considering I haven't seen any complaints yet about the 0.225 mm slack in either direction those headers have with the current via hole diameter.
Component height might become an issue, for example if you have DIP sockets + DIP ICs on your shields.
Adding a "raiser" layer of DIP sockets may look a bit weird but it would give almost the same height (~ 8.5mm) as a standard female header (8 mm).
Pin compatibility is obviously the major issue.
Personally I would solve that by using SIP sockets on some of my DigiSparks and standard headers on some of them, depending on what I would want to use them for.
It's always good with extra options that don't have any unavoidable side effect. ;-)
For example I would probably use standard headers on one or two "prototyping"/breadboarding DigiSparks and when I have a project that I would like to make more permanent and more presentable I would check if it would be possible convert that build onto a DigiSpark (and shields) with SIP sockets to get a more proffessional/compact look and smaller enclosure.
I haven't done any extensive tests (yet) but logic dictates that the 0.6x0.6 mm square pins and the 0.5mm diameter SIP pins do not mate that well in their normal form..
The SIP pins would fit in a standard female header but it would probably not be a tight/secure fit.
Trying the opposite, square peg in a smaller round hole, would most definitely end in tears and frustration.
While snapping of a few SIP socket segments I actually separated the machined metal part from the plastic and it occured to me that it might be possible to solder together some sort of Frankenstein-ian "square pin to SIP" adapter pins (sanding/filing down a standard male header and securing it in the SIP socket with some solder) but that would only be suitable for prototyping purposes.
OK.. time to hit the brakes.. this post is getting huge.
Hope my "rant" makes sense and that I might be able to convince you. :-)