I looked around, and it appears that I don't have any quad flat pack IC breakout boards left to demonstrate this on, but I do have some SOIC's, so I'll be demonstrating this technique on an SOIC16 74HC595D 8-bit shift register. The pin pitch is different from the QFP you're going to be doing this on, but it works just the same thanks to capillary action of solder. I don't have a camera rig for this, so there are no action shots, just post-step shots.
Put a dab of solder on pads on opposite sides. We'll use this to tack the part down.
Place the part on top of the pads, holding them with tweezers. While the part is held in place, press the iron onto one of the pins that has solder under it. Don't worry about bridging; that will be fixed later. Once one pin is tacked down and straight enough, do any others. Keep in mind that while the first one is being worked on, you can still adjust position if necessary. It becomes difficult after that.
Now, ready the barf bag. One side at a time, dump solder on top of the pins, forming bridges across them.
It's important to do all sides before we do anything else, just to make sure the pins don't drift during cleanup.
This is the guy I used for clean up. It's possibly the cheapest, most readily available solder pump money can buy, but it gets the job done. Just heat the pins and suck up the solder as necessary.
You'll notice that sucking up solder will only remove solder that has not adhered to metal. Anything being repelled by the solder mask or free flowing will not stick around.
...and we're done. Hooray!
Looking at the DigiX, you have considerably less space to work with, but this technique should still work. The part you'll need to look out for is the initial alignment of the pins and maybe clearance for your iron near the 6-pin ISP header. I hope this helps!
